NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
10. Soldering
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65
0.95
0.50
0.60
occupied area
solder paste
0.50
(2×)
msa433
Dimensions in mm
Fig 14. Reflow soldering footprint SOD323 (SC-76)
5.00
4.40
1.40
solder lands
solder resist
occupied area
2.75 1.20
msa415
preferred transport direction during soldering
Dimensions in mm
Fig 15. Wave soldering footprint SOD323 (SC-76)
2.15
1.20
0.50 0.60
solder lands
solder paste
solder resist
occupied area
1.80
1.90
0.30
0.40
mgs343
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 16. Reflow soldering footprint SOD523 (SC-79)
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
11 of 20
PHILIPS [ NXP SEMICONDUCTORS ]
