BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
2.65
0.75
1.30
1.325
solder lands
solder paste
2
0.50
3
0.60
(3×)
2.35 0.85
1.90
(3×)
solder resist
occupied area
Dimensions in mm
1
0.55
(3×)
msa429
2.40
Dimensions in mm
Fig 21. Reflow soldering footprint SOT323 (SC-70)
4.60
4.00
1.15
2
3
3.65 2.10
2.70
solder lands
0.90
(2×)
solder resist
1
occupied area
Dimensions in mm
msa419
preferred transport direction during soldering
Dimensions in mm
Fig 22. Wave soldering footprint SOT323 (SC-70)
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
14 of 20
NXP [ NXP ]
