NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 19. Reflow soldering footprint SOD123F
1.30
R = 0.05 (8×)
0.30
R = 0.05 (8×)
0.90
0.60 0.70 0.80
(2×) (2×) (2×)
solder lands
solder paste
solder resist
occupied area
0.30
(2×)
0.40
(2×)
0.50
(2×)
mbl872
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD882
BAS70_1PS7XSB70_SER_9
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 13 January 2010
13 of 20
PHILIPS [ NXP SEMICONDUCTORS ]
