NXP Semiconductors
1PS70SB15
Dual Schottky barrier diode
4.6
2.575
1.425
(3×)
solder lands
solder resist
occupied area
3.65 2.1
09
(2×)
1.8
Dimensions in mm
preferred transport
direction during soldering
sot323_fw
Fig. 6.
Wave soldering footprint for SC-70 (SOT323)
14. Revision history
Table 8.
Revision history
Release date
20121217
Data sheet status
Product data sheet
Change notice
-
Supersedes
1PS70SB10_14_15_16
v.1
Data sheet ID
1PS70SB15 v.2
Modifications:
•
•
•
•
•
•
•
•
•
•
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The format of this document has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Sections 1 to 3 updated
Section 4 "Quick reference data" added
Section 6 "Ordering information" added
Section 7 "Marking" updated
Table 5 "Limiting values": ambient temperature T
amb
and junction temperature T
j
updated
Figues 1, 2 and 3 updated
Section 11 "Test information" added
Figure 4: superseded by minimized package outline drawing
Section 13 "Soldering" added
Section 14 "Legal information" updated
Product data sheet
-
-
1PS70SB10_14_15_16 19990426
v.1
1PS70SB15
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved
Product data sheet
17 December 2012
6/9
PHILIPS [ NXP SEMICONDUCTORS ]
