NXP Semiconductors
1PS70SB15
Dual Schottky barrier diode
12. Package outline
2.2
1.8
3
0.45
0.15
1.1
0.8
2.2 1.35
2.0 1.15
1
1.3
Dimensions in mm
2
0.4
0.3
0.25
0.10
04-11-04
Fig. 4.
Package outline SC-70 (SOT323)
13. Soldering
2.65
1.85
1.325
solder lands
2
solder resist
1.3
solder paste
occupied area
Dimensions in mm
2.35
0.6
(3×)
3
1
0.5
(3×)
0.55
(3×)
sot323_fr
Fig. 5.
Reflow soldering footprint for SC-70 (SOT323)
1PS70SB15
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© NXP B.V. 2012. All rights reserved
Product data sheet
17 December 2012
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