To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
AXA2R
3. On board mounting reverse type (Without standoff)
Part No.
AXA2R63061∗
(With card jump-out prevention function)
AXA2R63021∗
(Without card jump-out prevention function)
19.15
17.50
2.50
*0.08 (Standoff dimensions)
Circuit schematic
(3.40)
2.70
0.625
(Signal/Detection contact)
0.10
Terminal coplanarity
9.375
No. 3
0.60
CAD Data
No. 2
No. 1
Card center
13.50
0.70
14.65
(2.10)
28.15
17.50
SD memory card
(Contact pitch) 2.50 0.1
1.65 0.1
(0.625)
14.55
27.95
Detailed internal view
View of set card
Recommended PC board pattern (TOP VIEW)
(30.15)
19.15 0.05
17.50 0.05
0.625 0.05
2.50 0.05 (Pitch)
3
: Pattern insulation
is recommended.
(Whole area)
1.00 0.05
(15.65)
12.25 0.05
1.75 0.05
2
1
12.45 0.05
1.55 0.05
(24.00)
1.60 0.05
0.60 0.05
0.40 0.05
SD memory card
Socket edge
Substrate edge
14.55 0.05
Through hole
0.60 0.05
0.40 0.05
1.60 0.05
PC board both side
27.95 0.05
* Standoff dimension is the dimension that takes into account the solder resist or
silk screen printing thickness on the PC board in order to preserve the dimension
from the surface of the PC board to the bottom of the socket.
Contact status of the card detection and write protect switches
Write protect switch
Card attachment
condition
Card detection
switch
Write unable
Write enable
Open
Card not attached
Card attached
Open
Open
Open
Closed
1–3
Closed
Recommended metal mask pattern
Terminal number
1–2
Metal mask thickness: 120µm
17.5 0.05 (2.5×7)
2.5 0.05 (pitch)
1.65 0.05
9-1.0 0.03
6.27 0.05
5.88 0.05
1.31 0.03
Metal mask opening area ratio: 80%
1.55 0.03
1.75 0.03
Metal mask opening area ratio: 100%
1.60 0.03
1.60 0.03
Socket edge
29.95 0.05
Metal mask opening area ratio: 75%
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