To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
AXA2R
PRODUCT TYPES
Card jump-out
prevention
function
Standoff
height
(mm)
Packing quantity
Product
name
Carddetection
Mounting
type
Eject type
Part No.
switch
Inner carton
Outer carton
Standard
mounting
type
0
1. 5
0
AXA2R73061∗
AXA2R73361∗
Available
Reverse
mounting
type
AXA2R63061∗ Asterisk “ ∗ ” mark on end of Asterisk “ ∗ ” mark on end of
Sockets for
Part No.;
Part No.;
1.5
0
AXA2R63361∗
AXA2R73021∗
AXA2R73321∗
AXA2R63021∗
AXA2R63321∗
SD memory Push-push
P: 350 pieces (1 reel)
(Embossed tape package)
T: 35 pieces (1 tray)
(Tray package)
P: 700 pieces (2 reels)
(Embossed tape package)
T: 700 pieces (20 trays)
(Tray package)
Available
card
type
Standard
mounting
type
(R type)
1.5
0
Not available
Reverse
mounting
type
1.5
SPECIFICATIONS
1. Characteristics
Item
Specifications
Condition
Rated Current
0.5 A/1 terminal
Signal contact portion: Max. 100mΩ (Initial)
Detection contact portion: Max. 150mΩ (Initial)
(Card detection and write protection detection)
Measured based on the HP4338B measurement
method of JIS C5402
Contact resistance
Electrical
characteristics
Insulation resistance
Min. 1,000MΩ (Initial)
Using 500V DC megger (applied for 1 min.)
Rated voltage is applied for one minute and check
for short circuit or damage with a detection current
of 1 mA.
Breakdown voltage
500V AC for 1 min.
Frequency: 10 to 55 Hz
Vibration resistance
Acceleration: 20.0 m/s2 {2.0G}
No current interruption for more than 0.1 µs
Mechanical
characteristics
Card insertion force
Card removal force
Max. 40N
Min. 1N, Max. 40N
Insertion and removal life: 10,000 times
Contact resistance after testing:
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 150mΩ
(Card detection and write protection detection)
Lifetime
characteristics
Insertion and removal
life of card
Insertion and removal speed are at a rate of 600
times/hour or less.
Ambient temperature
Storage temperature
–25°C to +90°C
No freezing or condensation in low temperatures
No freezing or condensation in low temperatures
–40°C to +90°C (The allowable storage temperature is –40°C to +50°C
if unopened from original packaging)
Resistance to soldering Reflow soldering: peak temperature 250°C or less
Sockets (shell) surface temperature for using
infrared reflow soldering machine
Environmental
characteristics
heat
Hand soldering: Soldering iron temperature 300°C, 5 sec. or less
Contact resistance:
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 150mΩ
(Card detection and write protection detection)
Insulation resistance: Min. 100 MΩ
MIL-STD-1344A, METHOD 1002
Temperature: 40 2°C, Humidity: 90 to 95%RH,
Test time: 500 hours
Humidity tolerance
(mated condition)
Applicable memory card
Unit weight
SD memory card*1
2.9g
Note: *1. The above characteristics cannot be guaranteed when a card other than the specified ones is used.
2. Material and surface treatment
Portion
Material
Surface
Contact portion: Ni plating on base, PdNi plating + Au flash plating
Signal contact
Soldering portion: Ni plating on base, Au plating on surface
Contact/Soldering portion: Ni plating on base, Au plating on surface
Soldering portion: Ni strike, Partial Au plating
Copper alloy
Stainless steel
Detection contact
Retention solder tab
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