RSL10
PACKAGE DIMENSIONS
WLCSP51, 2.364x2.325
CASE 567MT
ISSUE A
NOTES:
E
A
B
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
PIN A1
REFERENCE
4. PACKAGE CENTER AND FOOTPRINT CENTER
ARE NOT COINCIDENT. REFER TO DIMENSION F
FOR OFFSETS.
D
MILLIMETERS
DIM
A
A1
A2
A3
b
MIN
0.319
0.060
0.237
0.022
0.09
NOM
0.350
0.075
0.250
0.025
MAX
0.381
0.090
0.263
0.028
0.12
2X
2X
0.05
C
0.10
0.05
0.08
C
D
E
e
F
2.325 BSC
2.364 BSC
0.252 BSC
0.0198 BSC
TOP VIEW
A3
A
A2
C
A1
0.03
C
SEATING
NOTE 3
C
SIDE VIEW
F
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
0.0198
e/2
0.252
51X
b
PITCH
A1
e
0.05
0.03
C A B
L
K
C
0.252
e
e/2
PITCH
J
H
F
D
C
B
A
G
E
0.126
NOTE 4
51X
0.10
DIMENSIONS: MILLIMETERS
5
7
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
1
2 3 4 6 8 9 10 11
BOTTOM VIEW
www.onsemi.cn
19
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