RSL10
PACKAGE DIMENSIONS
QFN48 6x6, 0.4P
CASE 485BA
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
L
L
D
A B
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL TIP
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
LOCATION
L1
DETAIL A
MILLIMETERS
ALTERNATE TERMINAL
CONSTRUCTIONS
E
DIM MIN
MAX
1.00
0.05
A
A1
A3
b
0.80
0.00
0.20 REF
2X
0.10
C
EXPOSED Cu
MOLD CMPD
0.15
0.25
D
D2
E
6.00 BSC
4.40
4.60
2X
TOP VIEW
0.10
C
6.00 BSC
E2
e
K
L
L1
4.40
0.40 BSC
0.20 MIN
0.30
0.00
4.60
A
(A3)
DETAIL B
DETAIL B
0.10
C
C
ALTERNATE
0.50
0.15
CONSTRUCTION
0.08
A1
NOTE 4
SEATING
PLANE
SIDE VIEW
D2
C
SOLDERING FOOTPRINT*
6.40
4.66
K
48X
0.68
DETAIL A
13
25
E2
48X
L
4.66
6.40
1
48
37
e
48X b
e/2
BOTTOM VIEW
0.07
C
C
A B
PKG
OUTLINE
48X
0.25
0.05
NOTE 3
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.cn
18
ONSEMI [ ONSEMI ]
