MC74VHCT157A
MAXIMUM RATINGS
(Note 1)
Symbol
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
I
CC
P
D
T
STG
V
ESD
Positive DC Supply Voltage
Digital Input Voltage
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, V
CC
and GND Pins
Power Dissipation in Still Air
Storage Temperature Range
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Above V
CC
and Below GND at 125°C (Note 5)
SOIC Package
TSSOP
SOIC Package
TSSOP
Output in 3−State
High or Low State
Parameter
Value
−0.5 to +7.0
−0.5 to +7.0
−0.5 to +7.0
−0.5 to V
CC
+0.5
−20
$20
$25
$75
200
180
−65 to +150
>2000
>200
>2000
$300
143
164
Unit
V
V
V
mA
mA
mA
mA
mW
°C
V
I
LATCHUP
q
JA
Latchup Performance
mA
°C/W
Thermal Resistance, Junction−to−Ambient
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the
Recommended Operating Conditions.
2. Tested to EIA/JESD22−A114−A
3. Tested to EIA/JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
V
OUT
T
A
t
r
, t
f
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range, all Package Types
Input Rise or Fall Time
V
CC
= 5.0 V + 0.5 V
Output in 3−State
High or Low State
Characteristics
Min
4.5
0
0
−55
0
Max
5.5
5.5
V
CC
125
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME TO
0.1% BOND FAILURES
NORMALIZED FAILURE RATE
Junction
Temperature
°C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 130
°
C
TJ = 120
°
C
TJ = 110
°
C
TJ = 100
°
C
TJ = 80
°
C
100
TIME, YEARS
TJ = 90
°
C
1
1
10
1000
Figure 4. Failure Rate vs. Time Junction Temperature
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