MBRS2H100T3G, MBRA2H100T3G
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE F
H
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
E
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.
MILLIMETERS
INCHES
DIM
A
A1
b
c
D
E
H
E
L
MIN
1.97
0.05
1.27
0.15
2.29
4.06
4.83
0.76
NOM
2.10
0.10
1.45
0.28
2.60
4.32
5.21
1.14
MAX
MIN
NOM
0.083
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.087
0.006
0.064
0.016
0.115
0.180
0.220
0.060
2.20
0.15
1.63
0.41
2.92
4.57
5.59
1.52
0.078
0.002
0.050
0.006
0.090
0.160
0.190
0.030
b
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
A
A1
c
L
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
mm
inches
ǒ
Ǔ
SCALE 8:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
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