MBRS2H100T3G, MBRA2H100T3G
TYPICAL CHARACTERISTICS
1000
100
50% (DUTY CYCLE)
20%
10%
5.0%
2.0%
10
1.0%
1.0
0.1
SMB Die X 1.8 mm Die Y 1.8 mm
PCB Cu Area 11.8 mm PCB Cu thk 1.0 oz
2
SINGLE PULSE
0.01
0.000001 0.00001
0.0001
0.001
0.01
PULSE TIME (s)
0.1
1.0
10 100 1000
Figure 10. Thermal Response, Junction−to−Ambient (min pad) − MBRS2H100
100
10
50% (DUTY CYCLE)
20%
10%
5.0%
2.0%
1.0
0.1
1.0%
SINGLE PULSE
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
PULSE TIME (s)
0.1
1.0
10
100
1000
Figure 11. Thermal Response, Junction−to−Ambient (1 inch pad) − MBRA2H100
1000
100
50% (DUTY CYCLE)
20%
10%
5.0%
10
2.0%
1.0%
1.0
0.1
SINGLE PULSE
0.000001 0.00001
0.01
0.0001
0.001
0.01
PULSE TIME (s)
0.1
1.0
10
100
1000
Figure 12. Thermal Response, Junction−to−Ambient (min pad) − MBRA2H100
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