Typical Characteristics (continued)
1.2
1.1
1.0
2.5
2.0
1.5
1.0
0.5
0.0
※Notes:
1. VGS = 0 V
2. ID= 250 μA
0.9
※ Notes :
1. V = 10 V
2. IDG=S 42.5 A
0.8
-100
-100
-50
0
50
100
150
200
-50
0
50
100
150
200
T, Junction Temperature [oC]
T, Junction Temperature [oC]
J
J
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
100
103
102
101
100
Operation in This Area
isLimitedbyRDS(on)
80
60
40
20
0
100μ s
1 ms
10 ms
Limited by Package
DC
※Notes :
1. TC = 25 o
C
2. T = 175 o
C
J
3. Single Pulse
10-1
100
101
102
25
50
75
100
125
150
175
VDS, Drain-Source Voltage [V]
TC, Case Temperature [℃]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
1 0 0
D = 0 .5
0 .2
※
N o t e s
1 . Z θ J C(t )
2 . D u t y Fa c t o r , D =t 1 /t 2
:
=
0 .9 4 ℃ /W M a x.
1 0 -1
0 .1
3 . T J M
-
T C
=
P D M * Z θ J C(t )
0 .0 5
PDM
0 .0 2
0 .0 1
t1
s in g le p u ls e
t2
1 0 -2
1 0 - 5
1 0 -4
1 0 -3
1 0 -2
1 0 -1
1 0 0
1 0 1
t1 , S q u a re W a v e P u ls e D u ra tio n [s e c ]
Figure 11. Transient Thermal Response Curve
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FQP85N06 Rev. C1
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