Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.2
1.1
1.0
*Notes :
1. VGS = 0 V
0.9
*Notes :
1. VGS = 10 V
2. ID = 250µA
2. ID = 2.0 A
0.8
-100
-50
0
50
100
150
200
-100
-50
0
50
100
150
200
TJ, Junction Temperature [οC]
TJ, Junction Temperature [oC]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
4
3
2
1
0
Operation in This Area
is Limited by R DS(on)
101
10 us
100 us
1 ms
10 ms
100
DC
* Notes :
1. TC = 25 o
C
2. TJ = 150 o
C
10-1
3. Single Pulse
100
101
102
103
25
50
75
100
125
150
TC, Case Temperature [oC]
VDS, Drain-Source Voltage [V]
Figure 11. Transient Thermal Response Curve
D=0.5
100
0.2
0.1
* Notes
:
1. ZθJC(t) = 2.5 oC/W Max.
2. D uty Factor, D =t1/t2
0.05
3. TJM - TC = PDM * ZθJC(t)
10-1
0.02
0.01
PDM
t1
t2
single pulse
10-2
10-5
10-4
10-3
10-2
10-1
100
101
t1, Square W ave Pulse Duration [sec]
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©2008 Fairchild Semiconductor Corporation
FCP4N60 Rev. C1
4
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