74HC595
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F−01
ISSUE B
16X
K
REF
0.10 (0.004)
0.15 (0.006) T U
S
M
T U
S
V
S
K
2X
L/2
16
9
J1
B
−U−
SECTION N−N
J
N
L
PIN 1
IDENT.
1
8
0.15 (0.006) T U
S
A
−V−
N
F
DETAIL E
C
0.10 (0.004)
−T−
SEATING
PLANE
D
G
H
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
0.36
16X
16X
1.26
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
12
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
0.25 (0.010)
M
K1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE
−W−.
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0
_
8
_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−−
0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0
_
8
_
−W−
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
0.65
PITCH
DIMENSIONS: MILLIMETERS
ONSEMI [ ON SEMICONDUCTOR ]
