BelaSigna 200
4.2.3. CSP Environmental Characteristics
All parts supplied against this specification have been qualified as follows:
Table 5:
Packaging Level
Moisture sensitivity level (MSL)
JEDEC Level 3
30°C / 60% RH for 192 hours
121°C / 100% RH / 2 atm for 168 hours
-65°C to 150°C for 1000 cycles
130°C / 85% RH for 100 hours
150°C for 1000 hours
Pressure cooker test (PCT)
Thermal cycling test (TCT)
Highly accelerated stress test (HAST)
High temperature stress test (HTST)
Board Level
Temperature
-40°C to 125°C for 1000 cycles with no failures
(for board thickness <40mils and underfilled CSP)
1m height with no failures
Drop
4.2.4. CSP Carrier Information
The devices will be provided in standard 7” Tape & Reel carrier with 5,000 parts per reel.
Note: all dimensions in millimeters
Figure 8: CSP Tape Dimensions
4.2.5. CSP Design Considerations
In order to achieve the highest level of miniaturization, the CSP package is constrained in ways that will factor into design decisions.
The CSP will only operate in HV mode, and therefore requires a 1.8V operating voltage. The number of pins is reduced to 40
(compared to 49 active pins on the QFN). This reduction eliminates access to GPIOs (0,1,2,6,15), LSAD 2, the I2S interface, and the IR
remote receiver.
For PCB manufacture with BelaSigna 200 CSP, ON Semiconductor recommends Solder-on-Pad (SoP) surface finish. With SoP, the
solder mask opening should be solder mask-defined and copper pad geometry will be dictated by the PCB vendor’s design
requirements.
Rev. 16 | Page 13 of 43 | www.onsemi.com
ONSEMI [ ONSEMI ]
