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0W344-005-XTP 参数 Datasheet PDF下载

0W344-005-XTP图片预览
型号: 0W344-005-XTP
PDF下载: 下载PDF文件 查看货源
内容描述: 1.0 GENRAL说明 [1.0 Genral Description]
分类和应用:
文件页数/大小: 43 页 / 1433 K
品牌: ONSEMI [ ONSEMI ]
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BelaSigna 200  
4.2.3. CSP Environmental Characteristics  
All parts supplied against this specification have been qualified as follows:  
Table 5:  
Packaging Level  
Moisture sensitivity level (MSL)  
JEDEC Level 3  
30°C / 60% RH for 192 hours  
121°C / 100% RH / 2 atm for 168 hours  
-65°C to 150°C for 1000 cycles  
130°C / 85% RH for 100 hours  
150°C for 1000 hours  
Pressure cooker test (PCT)  
Thermal cycling test (TCT)  
Highly accelerated stress test (HAST)  
High temperature stress test (HTST)  
Board Level  
Temperature  
-40°C to 125°C for 1000 cycles with no failures  
(for board thickness <40mils and underfilled CSP)  
1m height with no failures  
Drop  
4.2.4. CSP Carrier Information  
The devices will be provided in standard 7” Tape & Reel carrier with 5,000 parts per reel.  
Note: all dimensions in millimeters  
Figure 8: CSP Tape Dimensions  
4.2.5. CSP Design Considerations  
In order to achieve the highest level of miniaturization, the CSP package is constrained in ways that will factor into design decisions.  
The CSP will only operate in HV mode, and therefore requires a 1.8V operating voltage. The number of pins is reduced to 40  
(compared to 49 active pins on the QFN). This reduction eliminates access to GPIOs (0,1,2,6,15), LSAD 2, the I2S interface, and the IR  
remote receiver.  
For PCB manufacture with BelaSigna 200 CSP, ON Semiconductor recommends Solder-on-Pad (SoP) surface finish. With SoP, the  
solder mask opening should be solder mask-defined and copper pad geometry will be dictated by the PCB vendor’s design  
requirements.  
Rev. 16 | Page 13 of 43 | www.onsemi.com