PEDL5501-02
OKI Semiconductor
ML5501
Physical Dimensions (All dimensions are in millimeters)
P-WQFN20-0707-1.00-3
Preliminary
Package material
Lead frame material
Lead finish
Epoxy resin
Cu alloy
Ni/Pd/Au
Pin treatment
Package weight (g)
Rev. No./Last Revised
Au/Pd Max. 0.01/Max. 0.15
5
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales
person for the product name, package name, pin number, package code and desired mounting
conditions (reflow method, temperature and times).
Rev 1.0
11 / 13