P5CD016/021/041/051 and P5Cx081
NXP Semiconductors
Secure dual interface and contact PKI smart card controller
5. Ordering information
Table 3.
Ordering information
Type number
Package
Name
FFC
Description
Version
P5CC081UA
P5CD016UA
P5CD021UA
P5CD041UA
P5CD051UA
P5CD081UA
P5CN081UA
P5CD016UE
P5CD021UE
P5CD041UE
P5CD051UE
P5CD081UE
P5CD016HN
P5CD021HN
P5CC081HN
P5CN081HN
P5CD016A4
P5CD041A4
P5CD051A4
P5CD081A4
P5CD016A6
P5CD041A6
P5CD051A6
P5CD081A6
P5CC081XS
P5CC081XD
8 inch wafer (sawn; 150 μm thickness; on film frame carrier;
electronic fail die marking according to SECSII format)
not applicable
FFC
8 inch wafer (sawn; 75 μm thickness; on film frame carrier;
electronic fail die marking according to SECSII format)
not applicable
SOT617-1
HVQFN32
MOB4
plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 × 5 × 0.85 mm
contactless chip card module (super 35 mm tape format, module SOT500-2
thickness 320 μm)
MOB6
contactless chip card module (super 35 mm tape format, module SOT500-3
thickness 250 μm)
PCM1.1
contact chip card module (super 35 mm tape format, 8-contact)
SOT658-1
SOT658-1
Pd-PCM1.1
palladium plated contact chip card module (super 35 mm tape
format, 8-contact)
P5CD016X1
P5CD021X1
P5CD041X1
P5CD051X1
P5CD081X1
P5CD016X0
P5CD021X0
P5CD041X0
P5CD051X0
P5CD081X0
PDM1.1
dual interface chip card module (plug-in type; super 35 mm tape SOT658-3
format, 8-contact)
PDM1.1
dual interface chip card module (super 35 mm tape format,
8-contact)
SOT658-3
P5CD016_021_041_51_Cx081_FAM_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 14 March 2011
150332
10 of 20
NXP [ NXP ]
