LPC546xx
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Footprint information for reflow soldering of TFBGA180 package
SOT570-3
Hx
P
P
Hy
see detail X
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
SL
SP
SR
occupied area
solder resist
detail X
DIMENSIONS in mm
P
SL
SP
SR
Hx
Hy
0.80
0.400 0.400 0.550 12.575 12.575
sot570-3_fr
Fig 56. Reflow soldering of the TFBGA180 package
LPC546xx
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© NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet
Rev. 2.5 — 20 June 2018
159 of 169
NXP [ NXP ]
