LPC546xx
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Footprint information for reflow soldering of LQFP100 package
SOT407-1
Hx
Gx
(0.125)
P2
P1
Hy Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500 0.560 17.300 17.300 14.300 14.300 1.500 0.280 0.400 14.500 14.500 17.550 17.550
sot407-1
Fig 55. Reflow soldering of the LQFP100 package
LPC546xx
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© NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet
Rev. 2.5 — 20 June 2018
158 of 169
NXP [ NXP ]
