NXP Semiconductors
BAV99 series
High-speed switching diodes
2.65
solder lands
2.35 1.5
0.6 0.5
(4×) (4×)
0.4 (2×)
solder resist
solder paste
0.5
(4×)
0.6
(4×)
1.8
0.6
(2×)
occupied area
Dimensions in mm
sot363_fr
Fig 12. Reflow soldering footprint BAV99S (SOT363/SC-88)
1.5
solder lands
4.5
0.3 2.5
solder resist
occupied area
1.5
Dimensions in mm
preferred transport
direction during soldering
1.3
2.45
5.3
1.3
sot363_fw
Fig 13. Wave soldering footprint BAV99S (SOT363/SC-88)
BAV99_SER_7
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 07 — 14 April 2010
9 of 14
PHILIPS [ NXP SEMICONDUCTORS ]
