NXP Semiconductors
BAV99 series
High-speed switching diodes
2.65
1.85
1.325
solder lands
2
solder resist
solder paste
occupied area
Dimensions in mm
2.35
0.6
(3×)
3
1.3
0.5
(3×)
1
0.55
(3×)
sot323_fr
Fig 14. Reflow soldering footprint BAV99W (SOT323/SC-70)
4.6
2.575
1.425
(3×)
solder lands
solder resist
occupied area
3.65 2.1
1.8
Dimensions in mm
preferred transport
direction during soldering
09
(2×)
sot323_fw
Fig 15. Wave soldering footprint BAV99W (SOT323/SC-70)
BAV99_SER_7
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 07 — 14 April 2010
10 of 14
PHILIPS [ NXP SEMICONDUCTORS ]
