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NAND01GW3B2CZA6T 参数 Datasheet PDF下载

NAND01GW3B2CZA6T图片预览
型号: NAND01GW3B2CZA6T
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 128MX8, 35ns, PBGA63, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63]
分类和应用: 闪存存储内存集成电路
文件页数/大小: 60 页 / 1343 K
品牌: NUMONYX [ NUMONYX B.V ]
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Memory array organization  
NAND01G-B2B, NAND02G-B2C  
2
Memory array organization  
The memory array is made up of NAND structures where 32 cells are connected in series.  
The memory array is organized in blocks where each block contains 64 pages. The array is  
split into two areas, the main area and the spare area. The main area of the array is used to  
store data whereas the spare area is typically used to store error correction codes, software  
flags or bad block identification.  
In x8 devices the pages are split into a 2048-byte main area and a spare area of 64 bytes. In  
the x16 devices the pages are split into a 1,024-word main area and a 32-word spare area.  
Refer to Figure 5: Memory array organization.  
2.1  
Bad blocks  
The NAND flash 2112-byte/1056-word page devices may contain bad blocks, that is blocks  
that contain one or more invalid bits whose reliability is not guaranteed. Additional bad  
blocks may develop during the lifetime of the device.  
The bad block Information is written prior to shipping (refer to Section 8.1: Bad block  
management for more details).  
Table 4: Valid blocks shows the minimum number of valid blocks in each device. The values  
shown include both the bad blocks that are present when the device is shipped and the bad  
blocks that could develop later on.  
These blocks need to be managed using bad blocks management, block replacement or  
error correction codes (refer to Section 8: Software algorithms).  
Table 4.  
Valid blocks  
Density of device  
Min  
Max  
2 Gbits  
1 Gbit  
2008  
1004  
2048  
1024  
12/60  
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