Nexperia
BAS316
High-speed switching diode
13. Soldering
3.05
2.1
solder lands
solder resist
1.65 0.95
0.5 (2×) 0.6 (2×)
solder paste
occupied area
2.2
Dimensions in mm
0.5
(2×)
0.6
(2×)
sod323_fr
Fig. 8. Reflow soldering footprint for SOD323
5
2.9
1.5 (2×)
solder lands
solder resist
occupied area
1.2
2.75
Dimensions in mm
(2×)
preferred transport
direction during soldering
sod323_fw
Fig. 9. Wave soldering footprint for SOD323
©
BAS316
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Product data sheet
1 July 2022
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NEXPERIA [ Nexperia ]
