22.1 Overview ................................................................................................................................... 671
22.2 Configuration............................................................................................................................ 671
22.3 Operation .................................................................................................................................. 672
CHAPTER 23 REGULATOR ..................................................................................................................675
23.1 Overview ................................................................................................................................... 675
23.2 Operation .................................................................................................................................. 675
CHAPTER 24 ROM CORRECTION FUNCTION..................................................................................677
24.1 Overview ................................................................................................................................... 677
24.2 Control Registers ..................................................................................................................... 678
24.2.1 Correction address registers 0 to 3 (CORAD0 to CORAD3)........................................................ 678
24.2.2 Correction control register (CORCN)........................................................................................... 679
24.3 ROM Correction Operation and Program Flow..................................................................... 679
CHAPTER 25 FLASH MEMORY...........................................................................................................681
25.1 Features .................................................................................................................................... 681
25.2 Writing with Flash Programmer.............................................................................................. 682
25.3 Programming Environment..................................................................................................... 688
25.4 Communication Mode.............................................................................................................. 688
25.5 Pin Processing ......................................................................................................................... 691
25.5.1 VPP pin ......................................................................................................................................... 691
25.5.2 Serial interface pins ..................................................................................................................... 692
25.5.3 RESET pin................................................................................................................................... 694
25.5.4 Port pins ...................................................................................................................................... 694
25.5.5 Other signal pins.......................................................................................................................... 694
25.5.6 Power supply ............................................................................................................................... 694
25.6 Programming Method.............................................................................................................. 695
25.6.1 Controlling flash memory............................................................................................................. 695
25.6.2 Flash memory programming mode.............................................................................................. 696
25.6.3 Selecting communication mode................................................................................................... 696
25.6.4 Communication commands ......................................................................................................... 697
25.6.5 Resources used........................................................................................................................... 698
CHAPTER 26 ELECTRICAL SPECIFICATIONS..................................................................................699
CHAPTER 27 PACKAGE DRAWINGS .................................................................................................741
CHAPTER 28 RECOMMENDED SOLDERING CONDITIONS............................................................745
APPENDIX A REGISTER INDEX ..........................................................................................................748
APPENDIX B REVISION HISTORY ......................................................................................................755
18
User’s Manual U15862EJ3V0UD
NEC [ NEC ]
