■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
AEC-Q200 Test Method
17 Board Flex
Appearance
Capacitance
No marking defects
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig1.
Within the specified initial value.
Within the specified initial value.
Within the specified initial value.
Then apply a force in the direction shown in Fig 2 for 60 seconds.
The soldering should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free of defects
such as heat shock.
D.F.
Series
GRT03
GRT15
GRT18
GRT21
GRT31
GRT32
a
b
c
0.3
0.5
0.6
0.8
2.0
2.0
0.9
1.5
2.2
3.0
4.4
4.4
0.3
0.6
0.9
1.3
1.7
2.6
Insulation
Resistance
25℃
(in mm)
Pressurization
50 min.
speed
1.0mm/s
20
b
Land
f4.5
Pressurize
R4
a
Flexure：2
(Chip thickness＞0.85mm rank
High Dielectric Type)
Flexure：1
(Chip thickness≦0.85mm rank
High Dielectric Type)
100
Capacitance meter
45 45
t : 1.6mm
(GRT03,15:0.8mm)
Fig.1
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀFig.2
18 Terminal
Strength
Appearance
Capacitance
No marking defects
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig3.
Then apply 18N* force in parallel with the test jig for 60 seconds.
The soldering should be done either with an iron or using the reflow
Within the specified initial value.
Within the specified initial value.
Within the specified initial value.
method and should be conducted with care so that the soldering is
uniform and free of defects such as heat shock
*2N(GRT03,15)
D.F.
Series
GRT03
GRT15
GRT18
GRT21
GRT31
GRT32
a
b
c
0.3
0.4
1.0
1.2
2.2
2.2
0.9
1.5
3.0
4.0
5.0
5.0
0.3
0.5
1.2
1.65
2.0
2.9
Insulation
Resistance
25℃
（in mm）
c
t : 1.6mm
(GRT03,15:0.8mm)
Solder resist
Baked electrode
or copper foil
Fig.3
19 Beam Load Test
Destruction value should be exceed following one.
< Chip L dimension : 2.5mm max. >
Chip thickness > 0.5mm rank : 20N
Chip thickness = 0.5mm rank : 8N
Place the capacitor in the beam load fixture as Fig 4.
Apply a force.
< Chip Length : 2.5mm max. >
Chip thickness = 0.3mm rank : 5N
Iron Board
Chip thickness < 0.3mm rank : 2.5N
< Chip L dimension : 3.2mm min. >
Chip thickness < 1.25mm rank : 15N
ꢀꢀChip thickness ≧1.25mm rank : 54.5N
< Chip Length : 3.2mm min. >
L
0.6L
Fig.4
Speed supplied the Stress Load : *0.5mm/s
*GRT03 : 0.1mm/s
JEMCGS-01744N
5
MURATA [ muRata ]
