• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
!Note
C02E.pdf
10.12.20
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution
Continued from the preceding page.
6. Correction with a Soldering Iron
When sudden heat is applied to the components by use
of a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change causes deformations inside the
components.
components and the PCB), should be within the
conditions of table 3.
It is required to keep the temperature differential between
the soldering Iron and the component's surface (∆T) as
small as possible.
In order to prevent mechanical damage to the
components, preheating is required for both the
components and the PCB board.
After soldering, do not allow the component/PCB to cool
down rapidly.
The operating time for the re-working should be as short
as possible. When re-working time is too long, it may
cause solder leaching, in turn causing a reduction of the
adhesive strength of the terminations.
Preheating conditions, (The "Temperature of the
Soldering Iron Tip", "Preheating Temperature,"
"Temperature Differential" between iron tip and the
Table 3
Temperature
of Soldering
Iron tip
Temperature
Differential
(∆T)
Preheating
Temperature
Part Number
Atmosphere
G--18/21/31
350°C max. 150°C min. ∆TV190D
air
air
G--32/42/43/
52/55
280°C max. 150°C min. ∆TV130D
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Optimum Solder Amount when re-working Using a
Soldering Iron
For sizes smaller than Gpp18, the top of the solder fillet
should be lower than 2/3 of the thickness of the
component or 0.5mm whichever is smaller.
For sizes larger than Gpp21, the top of the solder fillet
should be lower than 2/3 of the thickness of the
component.
Solder Amount
in section
If the solder amount is excessive, the risk of cracking is
higher during board bending or under any other stressful
conditions.
A Soldering iron ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from
touching the components during the re-work.
Solder wire with ø0.5mm or smaller is required for
soldering.
7. Washing
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
broken solder. Take note not to vibrate PCBs.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
213
MURATA [ muRata ]
