• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
!Note
C02E.pdf
10.12.20
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution
Continued from the preceding page.
4. Reflow Soldering
When components are exposed to sudden heat, their
mechanical strength can be decreased due to the
extreme temperature changes which can cause flexing
and result in internal mechanical damage, which will
cause the parts to fail. In order to prevent mechanical
damage, preheating is required for both the components
and the PCB board. Preheating conditions are shown in
Table 1. It is required to keep the temperature differential
between the soldering and the components surface (∆T)
as small as possible.
[Standard Conditions for Reflow Soldering]
Infrared Reflow
Temperature (D)
Peak Temperature
200°C
Soldering
Gradual
Cooling
∆T
170°C
150°C
130°C
Preheating
Solderability of Tin plating termination chips might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chips before use.
Time
60-120 seconds 30-60 seconds
Vapor Reflow
Temperature (D)
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
(∆T) between the component and solvent within the
range shown in the Table 1.
Soldering
Peak Temperature
Gradual
Cooling
∆T
170°C
150°C
130°C
Table 1
Preheating
Part Number
G--18/21/31
Temperature Differential
∆TV190D
G--32/42/43/52/55
∆TV130D
Time
20 seconds max.
60-120 seconds
Recommended Conditions
Pb-Sn Solder
Infrared Reflow Vapor Reflow
[Allowable Soldering Temperature and Time]
Lead Free Solder
Peak Temperature
Atmosphere
230-250°C
230-240°C
240-260°C
270
260
250
240
230
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
0
30
60
90
Soldering Time (sec.)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Optimum Solder Amount for Reflow Soldering
Overly thick application of solder paste results in
excessive solder fillet height.
[Optimum Solder Amount for Reflow Soldering]
This makes the chip more susceptible to mechanical and
thermal stress on the board and may cause cracked
chips.
0.2mm min.
Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in chips
breaking loose from the PCB.
in section
Make sure the solder has been applied smoothly to the
end surface to a height of 0.2mm min.
Inverting the PCB
Make sure not to impose an abnormal mechanical shock on
the PCB.
Continued on the following page.
211
MURATA [ muRata ]
