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GRM1555C1H3R0WA01D 参数 Datasheet PDF下载

GRM1555C1H3R0WA01D图片预览
型号: GRM1555C1H3R0WA01D
PDF下载: 下载PDF文件 查看货源
内容描述: 片状独石陶瓷电容器 [Chip Monolithic Ceramic Capacitors]
分类和应用: 电容器陶瓷电容器
文件页数/大小: 221 页 / 4341 K
品牌: MURATA [ muRata ]
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• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our  
!Note  
C02E.pdf  
10.12.20  
sales representatives or product engineers before ordering.  
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.  
Notice  
Notice (Soldering and Mounting)  
1. Construction of Board Pattern  
After installing chips, if solder is excessively applied to  
the circuit board, mechanical stress will cause destruction  
resistance characteristics to lower. To prevent this, be  
extremely careful in determining shape and dimension  
before designing the circuit board diagram.  
Construction and Dimensions of Pattern (Example)  
Flow Soldering  
Chip Capacitor  
LgW  
a
b
c
Solder Resist  
1.6g0.8  
2.0g1.25  
3.2g1.6  
0.6-1.0  
1.0-1.2  
2.2-2.6  
0.8-0.9  
0.9-1.0  
1.0-1.1  
0.6-0.8  
0.8-1.1  
1.0-1.4  
c
L
W
Flow soldering : 3.2g1.6 or less available.  
Land  
b
a
Reflow Soldering  
LgW  
1.6g0.8  
2.0g1.25  
3.2g1.6  
3.2g2.5  
4.5g2.0  
4.5g3.2  
5.7g2.8  
5.7g5.0  
a
b
c
0.6-0.8  
1.0-1.2  
2.2-2.4  
2.0-2.4  
2.8-3.4  
2.8-3.4  
4.0-4.6  
4.0-4.6  
0.6-0.7  
0.6-0.7  
0.8-0.9  
1.0-1.2  
1.2-1.4  
1.2-1.4  
1.4-1.6  
1.4-1.6  
0.6-0.8  
0.8-1.1  
1.0-1.4  
1.8-2.3  
1.4-1.8  
2.3-3.0  
2.1-2.6  
3.5-4.8  
(in mm)  
Dimensions of Slit (Example)  
Chip Capacitor  
Slit  
Solder Resist  
LgW  
1.6g0.8  
2.0g1.25  
3.2g1.6  
3.2g2.5  
4.5g2.0  
4.5g3.2  
5.7g2.8  
5.7g5.0  
d
e
-
-
-
-
d
L
1.0-2.0  
1.0-2.0  
1.0-2.8  
1.0-2.8  
1.0-4.0  
1.0-4.0  
3.2-3.7  
4.1-4.6  
3.6-4.1  
4.8-5.3  
4.4-4.9  
6.6-7.1  
e
W
Land  
Preparing the slit helps flux cleaning and resin  
coating on the back of the capacitor.  
However, the length of the slit design should  
be as short as possible to prevent mechanical  
damage in the capacitor.  
(in mm)  
A longer slit design might receive more severe  
mechanical stress from the PCB.  
Recommended slit design is shown in the  
Table.  
Continued on the following page.  
214  
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