Table A Capacitance Change between at Reference Temp. and at each Temp. (%)
-55℃
-30℃
-10℃
Char.
5C
Max.
0.58
Min.
-0.24
Max.
0.4
Min.
-0.17
Max.
0.25
Min.
-0.11
Board Flex
・Test substrate
Material
Except for Board Flex
・Test substrate
Material
Glass epoxy PCB
1.6mm
Glass epoxy PCB
1.6mm
Thickness
Thickness
・Land Dimension
・Land Dimension
Dimension(mm)
Dimension(mm)
b c
Type
Type
a
a
b
c
GCM21
0.8
3.0
1.3
GCM21
1.2
4.0
1.65
・Pressurization Method
GCM2165C2A122GA16-01A
6