Mechanical Dimensions of the PBGA Package
14.2 Mechanical Dimensions of the PBGA Package
For more information on the printed circuit board layout of the PBGA package, including
thermal via design and suggested pad layout, please refer to Motorola Application Note,
Plastic Ball Grid Array (order number: AN1231/D), available from your local Motorola
sales office. Figure 14-75 shows the mechanical dimensions of the PBGA package.
C
0.2
4X
0.2 C
0.25 C
0.35 C
D
A
E2
E
D2
B
TOP VIEW
A2
A3
A1
A
D1
SIDE VIEW
18X e
NOTES:
1. Dimensions and tolerancing per ASME Y14.5M, 1994.
2. Dimensions in millimeters.
W
V
U
T
3. Dimension b is the maximum solder ball diameter
measured parallel to datum C.
R
P
N
M
L
K
J
E1
H
G
F
MILLIMETERS
E
D
C
B
A
DIM MIN
MAX
2.05
0.70
1.35
0.90
0.90
A
A1
A2
A3
b
---
0.50
0.95
0.70
0.60
1
3
5
7
9
11 13 15 17 19
2
4 6 8 10 12 14 16 18
357X
b
BOTTOM VIEW
M
0.3
C A B
C
D
25.00 BSC
22.86 BSC
M
0.15
D1
D2
e
22.40
22.60
1.27 BSC
25.00 BSC
22.86 BSC
E
E1
E2
22.40
22.60
Case No. 1103-01
Figure 14-75. Mechanical Dimensions and Bottom Surface Nomenclature
of the PBGA Package
MOTOROLA
MPC860 Family Hardware Specifications
73
MOTOROLA [ MOTOROLA ]
