MC1377
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 738–03
ISSUE E
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
20
1
11
10
B
C
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
1.070
0.260
0.180
0.022
MIN
25.66
6.10
3.81
0.39
MAX
27.17
6.60
4.57
0.55
1.010
0.240
0.150
0.015
–T–
SEATING
PLANE
K
E
0.050 BSC
1.27 BSC
0.050
0.070
1.27
1.77
F
G
J
K
L
M
0.100 BSC
2.54 BSC
N
E
0.008
0.110
0.015
0.140
0.21
2.80
0.38
3.55
G
F
0.300 BSC
7.62 BSC
J 20 PL
M
N
0
15
0
15
D 20 PL
0.25 (0.010)
M
M
0.25 (0.010)
T B
0.020
0.040
0.51
1.01
M
M
T
A
DW SUFFIX
PLASTIC PACKAGE
CASE 751D–04
(SO–20L)
–A–
ISSUE E
NOTES:
20
11
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006)
PER SIDE.
10X P
–B–
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL
IN EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
10
20X D
J
MILLIMETERS
INCHES
M
S
S
0.010 (0.25)
T
A
B
DIM
A
B
C
D
MIN
12.65
7.40
2.35
0.35
0.50
MAX
12.95
7.60
2.65
0.49
0.90
MIN
MAX
0.510
0.299
0.104
0.019
0.035
0.499
0.292
0.093
0.014
0.020
F
F
R X 45
G
J
K
M
P
R
1.27 BSC
0.050 BSC
0.25
0.10
0
0.32
0.25
7
0.010
0.004
0
0.012
0.009
7
C
10.05
0.25
10.55
0.75
0.395
0.010
0.415
0.029
SEATING
PLANE
–T–
M
18X G
K
17
MOTOROLA ANALOG IC DEVICE DATA
MOTOROLA [ MOTOROLA ]
