2Mb : 128K x 18, 64K x 32/36
FLOW-THROUGH SYNCBURST SRAM
165-PIN FBGA
0.85 ±0.075
0.10
A
SEATING PLANE
A
10.00
BALL A11
BALL A1
PIN A1 ID
1.20 MAX
1.00
(TYP)
PIN A1 ID
165X Ø 0.45
7.50 ±0.05
14.00
15.00 ±0.10
7.00 ±0.05
1.00
(TYP)
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
6.50 ±0.05
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb
SOLDER BALL PAD: Ø .33mm
5.00 ±0.05
13.00 ±0.10
MAX
MIN
NOTE: 1. All dimensions in millimeters
or typical where noted.
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM
MT58L128L18F_2.p65 – Rev. 8/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2000, Micron Technology, Inc.
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