2Mb: 128K x 18, 64K x 32/36
FLOW-THROUGH SYNCBURST SRAM
REVISIONHISTORY
Removed 165-pin FBGA package, Rev. 6/01 ..................................................................................................June/7/01
Removed FBGA Part Marking Guide, REV 8/00, FINAL ........................................................................ August/22/00
Changed FBGA capacitance values, REV 8/00, FINAL ............................................................................. August/7/00
CI; TYP 2.5pF from 4pF; MAX. 3.5pF from 5pF
CO; TYP 4pF from 6pF; MAX. 5pF from 7pF
CCK; TYP 2.5pF from 5pF; MAX. 3.5pF from 6pF
Removed IT References, REV 7/00, FINAL..................................................................................................... July/10/00
Added FBGA Part Marking Guide
Added Revision History to Datasheet
Removed IT from Part Number Example, REV 6/00, FINAL....................................................................... June/21/00
Added # of datalines to the databus in x32/36 Block Diagram
Changed tKQLZ from 4.0ns MIN to 1.5ns MIN
Added Note - “Preliminary Package Data” to FBGA Capacitance and Thermal Resistance Tables
Changed heading on Mechanical Drawing from BGA to FBGA
Added 165-Pin FBGA package, REV 3/00, FINAL ....................................................................................... May/23/00
Added PRELIMINARY PACKAGE DATA to diagram
2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM
MT58L128L18F_2.p65 – Rev. 6/01
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2000,MicronTechnology,Inc.
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