256Mb: x4, x8, x16 SDRAM
Package Dimensions
Figure 9: 54-Ball VFBGA "BG/FG" (8mm x 14mm) (x16)
0.65 ±0.05
SEATING PLANE
C
0.10 C
6.40
1.00 MAX
BALL A1 ID
0.80 TYP
54X Ø0.45
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
BALL A9
BALL A1 ID
BALL A1
0.80 TYP
C
6.40
14.00 ±0.10
L
3.20 ±0.05
7.00 ±0.05
C
L
3.20 ±0.05
4.00 ±0.05
8.00 ±0.10
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø 0.40
1. All dimensions are in millimeters.
Notes:
2. Recommended pad size for PCB is 0.4mm ±0.065mm.
3. Topside part-marking decoder is available at www.micron.com/decoder.
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. R 10/12 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 1999 Micron Technology, Inc. All rights reserved.
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