256Mb: x4, x8, x16 SDRAM
Package Dimensions
Figure 8: 60-Ball FBGA "FB/BB" (8mm x 16mm) (x4, x8)
0.155 ±0.013
0.850 ±0.05
0.10 A
SEATING PLANE
2.40 ±0.05
CTR
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn. 3% Ag, 0.5% Cu
A
60X Ø 0.45
SUBSTRATE:
PLASTIC LAMINATE
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. PRE-
REFLOW DIAMETER
IS 0.42 ON A 0.33 NSMD
BALL PAD.
8.00 ±0.10
5.60
0.80
TYP
ENCAPSULATION MATERIAL:
EPOXY NOVOLAC
BALL #1 ID
BALL #1 ID
BALL A1
BALL
A8
0.80
TYP
8.00 ±0.05
16.00 ±0.10
C
L
11.20
5.60
2.80
1.20 MAX
4.00 ±0.05
1. All dimensions are in millimeters.
Notes:
2. Recommended pad size for PCB is 0.33mm ±0.025mm.
3. Topside part-marking decoder is available at www.micron.com/decoder.
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. R 10/12 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 1999 Micron Technology, Inc. All rights reserved.
16
MICRON [ MICRON TECHNOLOGY ]
