256Mb: x4, x8, x16 SDRAM
Package Dimensions
Package Dimensions
Figure 7: 54-Pin Plastic TSOP "TG/P" (400 mil)
0.10
2X 2.28
Pin #1 ID
1.2 MAX
0.375 ±0.075 TYP
2X R 0.75
2X R 1.00
0.80 TYP
(for reference
only)
22.22 ±0.08
22.42
Package may
or may not be
assembled with
a location notch.
0.71
Plated lead finish: 90% Sn, 10% Pb or 100%Sn
Plastic package material: epoxy novolac
Package width and length do not
include mold protrusion. Allowable
protrusion is 0.25 per side.
10.16 ±0.08
11.76 ±0.20
Gage plane
0.25
Package may or may not be
assembled with a location notch.
+0.10
-0.05
0.10
+0.03
0.15
-0.02
0.50 ±0.10
See detail A
0.80
Detail A
1. All dimensions are in millimeters.
Notes:
2. Package width and length do not include mold protrusion; allowable mold protrusion is
0.25mm per side.
3. 2X means the notch is present in two locations (both ends of the device).
4. Package may or may not be assembled with a location notch.
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. R 10/12 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
15
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