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MT48LC8M16A2FB-8EL 参数 Datasheet PDF下载

MT48LC8M16A2FB-8EL图片预览
型号: MT48LC8M16A2FB-8EL
PDF下载: 下载PDF文件 查看货源
内容描述: 同步DRAM [SYNCHRONOUS DRAM]
分类和应用: 动态存储器
文件页数/大小: 59 页 / 1835 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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128Mb: x4, x8, x16  
SDRAM  
WRITEs  
WRITE bursts are initiated with a WRITE command,  
as shown in Figure 13.  
command applies to the new command. An example is  
shown in Figure 15. Data n + 1 is either the last of a burst  
of two or the last desired of a longer burst. The 128Mb  
SDRAM uses a pipelined architecture and therefore does  
not require the 2n rule associated with a prefetch archi-  
tecture. A WRITE command can be initiated on any clock  
cycle following a previous WRITE command. Full-speed  
random write accesses within a page can be performed to  
thesamebank, asshowninFigure16, oreachsubsequent  
WRITE may be performed to a different bank.  
The starting column and bank addresses are pro-  
vided with the WRITE command, and auto precharge is  
either enabled or disabled for that access. If auto  
precharge is enabled, the row being accessed is  
precharged at the completion of the burst. For the ge-  
neric WRITE commands used in the following illustra-  
tions, auto precharge is disabled.  
During WRITE bursts, the first valid data-in element  
will be registered coincident with the WRITE command.  
Subsequent data elements will be registered on each  
successive positive clock edge. Upon completion of a  
fixed-length burst, assuming no other commands have  
been initiated, the DQs will remain High-Z and any addi-  
tional input data will be ignored (see Figure 14). A full-  
page burst will continue until terminated. (At the end of  
the page, it will wrap to column 0 and continue.)  
Data for any WRITE burst may be truncated with a  
subsequentWRITEcommand, anddataforafixed-length  
WRITE burst may be immediately followed by data for a  
WRITE command. The new WRITE command can be  
issued on any clock following the previous WRITE com-  
mand, and the data provided coincident with the new  
T0  
T1  
T2  
T3  
CLK  
WRITE  
NOP  
NOP  
NOP  
COMMAND  
ADDRESS  
DQ  
BANK,  
COL n  
D
IN  
DIN  
n + 1  
n
NOTE:  
Burst length = 2. DQM is LOW.  
Figure 14  
WRITE Burst  
CLK  
CKE  
CS#  
HIGH  
T0  
T1  
T2  
CLK  
RAS#  
WRITE  
NOP  
WRITE  
COMMAND  
ADDRESS  
DQ  
CAS#  
WE#  
BANK,  
COL n  
BANK,  
COL b  
A0-A9, A11: x4  
A0-A9: x8  
COLUMN  
ADDRESS  
A0-A8: x16  
DIN  
DIN  
DIN  
b
n
n + 1  
A11: x8  
A9, A11: x16  
ENABLE AUTO PRECHARGE  
DISABLE AUTO PRECHARGE  
A10  
NOTE:  
DQM is LOW. Each WRITE  
command may be to any bank.  
DONT CARE  
BANK  
ADDRESS  
BA0,1  
Figure 15  
WRITE to WRITE  
Figure 13  
WRITE Command  
128Mb: x4, x8, x16 SDRAM  
128MSDRAM_E.p65 Rev. E; Pub. 1/02  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2001, Micron Technology, Inc.  
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