1Gb: x4, x8, x16 DDR2 SDRAM
Packaging
Figure 9: 60-Ball FBGA Package (8mm x 11.5mm) – x4, x8
0.8 ±0.1
Seating
plane
A
0.12 A
60X Ø0.45
Solder ball material:
Pb-free – (SAC305) SnAgCu
Ball A1 ID
Pb – (Eutectic) SnPbAg
Dimensions apply to solder
balls post-reflow on
Ball A1 ID
9
8
7
3
2
1
Ø0.35 SMD ball pads.
A
B
C
D
E
F
11.5 ±0.1
8 CTR
G
H
J
K
L
0.8 TYP
0.8 TYP
Exposed
gold-plated pad
1.0 MAX X 0.7
nonconductive
floating pad
1.2 MAX
0.25 MIN
6.4 CTR
8 ±0.1
1. All dimensions are in millimeters.
Note:
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. T 02/10 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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© 2004 Micron Technology, Inc. All rights reserved.
MICRON [ MICRON TECHNOLOGY ]
