1Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – Absolute Ratings
Table 6: Temperature Limits
Parameter
Symbol
TSTG
TC
Min
–55
0
Max
150
85
Units
°C
Notes
1
Storage temperature
Operating temperature: commercial
Operating temperature: industrial
°C
2, 3
TC
–40
–40
95
°C
2, 3, 4
4, 5
TA
85
°C
1. MAX storage case temperature TSTG is measured in the center of the package, as shown
in Figure 11. This case temperature limit is allowed to be exceeded briefly during pack-
age reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering
Parameters.”
Notes:
2. MAX operating case temperature TC is measured in the center of the package, as shown
in Figure 11.
3. Device functionality is not guaranteed if the device exceeds maximum TC during opera-
tion.
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
Figure 11: Example Temperature Test Point Location
Test point
Length (L)
0.5 (L)
0.5 (W)
Width (W)
Lmm x Wmm FBGA
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. T 02/10 EN
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