Table 57: Electrical Characteristics and AC Operating Conditions for Speed Extensions (Continued)
Notes 1–8 apply to the entire table
DDR3-1866
DDR3-2133
Parameter
Symbol
Min
Refresh Timing
Max
Min
Max
Unit Notes
REFRESH-to-ACTIVATE or REFRESH
command period
tRFC – 1Gb
tRFC – 2Gb
tRFC – 4Gb
tRFC – 8Gb
–
MIN = 110; MAX = 70,200
MIN = 160; MAX = 70,200
MIN = 260; MAX = 70,200
MIN = 350; MAX = 70,200
64 (1X)
ns
ns
ns
ns
Maximum refresh
period
TC ≤ 85°C
TC > 85°C
TC ≤ 85°C
TC > 85°C
ms
ms
μs
36
36
36
36
32 (2X)
Maximum average
periodic refresh
tREFI
7.8 (64ms/8192)
3.9 (32ms/8192)
μs
Self Refresh Timing
Exit self refresh to commands not requiring a
locked DLL
tXS
MIN = greater of 5CK or tRFC + 10ns; MAX = n/a
CK
CK
CK
CK
CK
Exit self refresh to commands requiring a
locked DLL
tXSDLL
tCKESR
tCKSRE
tCKSRX
MIN = tDLLK (MIN);
MAX = n/a
28
Minimum CKE low pulse width for self re-
fresh entry to self refresh exit timing
MIN = tCKE (MIN) + CK; MAX = n/a
MIN = greater of 5CK or 10ns; MAX = n/a
MIN = greater of 5CK or 10ns; MAX = n/a
Valid clocks after self refresh entry or power-
down entry
Valid clocks before self refresh exit,
power-down exit, or reset exit
Power-Down Timing
CKE MIN pulse width
tCKE (MIN)
tCPDED
Greater of 3CK or 5ns
CK
CK
Command pass disable delay
MIN = 2;
MAX = n/a
Power-down entry to power-down exit tim-
ing
tPD
tANPD
PDE
MIN = tCKE (MIN);
MAX = 9 * tREFI
CK
CK
CK
CK
Begin power-down period prior to CKE
registered HIGH
WL - 1CK
Power-down entry period: ODT either
synchronous or asynchronous
Greater of tANPD or tRFC - REFRESH command to CKE LOW time
tANPD + tXPDLL
Power-down exit period: ODT either
synchronous or asynchronous
PDX
MICRON [ MICRON TECHNOLOGY ]
