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MT41J256M4 参数 Datasheet PDF下载

MT41J256M4图片预览
型号: MT41J256M4
PDF下载: 下载PDF文件 查看货源
内容描述: DDR3 SDRAM MT41J256M4 â ????梅格32 ×4× 8银行MT41J128M8 â ????梅格16 ×8× 8银行MT41J64M16 â ???? 8梅格×16× 8银行 [DDR3 SDRAM MT41J256M4 – 32 Meg x 4 x 8 banks MT41J128M8 – 16 Meg x 8 x 8 banks MT41J64M16 – 8 Meg x 16 x 8 banks]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 214 页 / 2938 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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1Gb: x4, x8, x16 DDR3 SDRAM  
Power-Down Mode  
Power-Down Mode  
Power-down is synchronously entered when CKE is registered LOW coincident with a  
NOP or DES command. CKE is not allowed to go LOW while an MRS, MPR, ZQCAL,  
READ, or WRITE operation is in progress. CKE is allowed to go LOW while any of the  
other legal operations (such as ROW ACTIVATION, PRECHARGE, auto precharge, or RE-  
FRESH) are in progress. However, the power-down IDD specifications are not applicable  
until such operations have completed. Depending on the previous DRAM state and the  
command issued prior to CKE going LOW, certain timing constraints must be satisfied  
(as noted in Table 81). Timing diagrams detailing the different power-down mode entry  
and exits are shown in Figure 90 (page 185) through Figure 1±6 (page 19±).  
Table 81: Command to Power-Down Entry Parameters  
Last Command Prior to  
CKE LOW1  
DRAM Status  
Idle or active  
Idle or active  
Active  
Parameter (Min)  
tACTPDEN  
tPRPDEN  
Parameter Value  
1tCK  
Figure  
ACTIVATE  
PRECHARGE  
Figure 104 (page 189)  
Figure 105 (page 189)  
Figure 100 (page 187)  
Figure 101 (page 187)  
1tCK  
READ or READAP  
tRDPDEN  
tWRPDEN  
RL + 4tCK + 1tCK  
WL + 4tCK + tWR/tCK  
Active  
WRITE: BL8OTF, BL8MRS,  
BC4OTF  
Active  
Active  
WRITE: BC4MRS  
WL + 2tCK + tWR/tCK  
WL + 4tCK + WR + 1tCK  
Figure 101 (page 187)  
Figure 102 (page 188)  
WRITEAP: BL8OTF, BL8MRS,  
BC4OTF  
tWRAPDEN  
Active  
Idle  
WRITEAP: BC4MRS  
REFRESH  
WL + 2tCK + WR + 1tCK  
1tCK  
Greater of 10tCK or 24ns  
tMOD  
Figure 102 (page 188)  
Figure 103 (page 188)  
Figure 107 (page 190)  
Figure 106 (page 190)  
tREFPDEN  
tXPDLL  
tMRSPDEN  
Power-down  
Idle  
REFRESH  
MODE REGISTER SET  
1. If slow-exit mode precharge power-down is enabled and entered, ODT becomes asyn-  
chronous tANPD prior to CKE going LOW and remains asynchronous until tANPD +  
tXPDLL after CKE goes HIGH.  
Note:  
Entering power-down disables the input and output buffers, excluding CK, CK#, ODT,  
CKE, and RESET#. NOP or DES commands are required until tCPDED has been satis-  
fied, at which time all specified input/output buffers are disabled. The DLL should be in  
a locked state when power-down is entered for the fastest power-down exit timing. If  
the DLL is not locked during power-down entry, the DLL must be reset after exiting  
power-down mode for proper READ operation as well as synchronous ODT operation.  
During power-down entry, if any bank remains open after all in-progress commands are  
complete, the DRAM will be in active power-down mode. If all banks are closed after all  
in-progress commands are complete, the DRAM will be in precharge power-down  
mode. Precharge power-down mode must be programmed to exit with either a slow exit  
mode or a fast exit mode. When entering precharge power-down mode, the DLL is  
turned off in slow exit mode or kept on in fast exit mode.  
The DLL also remains on when entering active power-down. ODT has special timing  
constraints when slow exit mode precharge power-down is enabled and entered. Refer  
to Asynchronous ODT Mode (page 2±6) for detailed ODT usage requirements in slow  
PDF: 09005aef826aa906  
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
183  
‹ 2006 Micron Technology, Inc. All rights reserved.  
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