256MB, 512MB, 1GB (x72, ECC, DR), PC3200
184-PIN DDR SDRAM UDIMM
Fig u re 10: Co m p o n e n t Ca se Te m p e ra t u re vs. Air Flo w
100
90
80
70
60
50
40
30
20
Ambient Temperature = 25º C
Tmax- memory stress software
Tave- memory stress software
Tave- 3D gaming software
Minimum Air Flow
Air Flow (meters/sec)
NOTE:
1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM) across the module.
2. The component case temperature measurements shown above were obtained experimentally. The typical system to be
used for experimental purposes is a dual-processor 600 MHz work station, fully loaded, with four comparable registered
memory modules. Case temperatures charted represent worst-case component locations on modules installed in the
internal slots of the system.
3. Temperature versus air speed data is obtained by performing experiments with the system motherboard removed from
its case and mounted in a Eiffel-type low air speed wind tunnel. Peripheral devices installed on the system motherboard
for testing are the processor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel test
chamber.
4. The memory diagnostic software used for determining worst-case component temperatures is a memory diagnostic soft-
ware application developed for internal use by Micron Technology, Inc.
pdf: 09005aef80814e61, source: 09005aef80a43eed
DDA18C32_64_128x72AG.fm - Rev. E 9/04 EN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology, Inc.
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