M25P20 Serial Flash Embedded Memory
Maximum Ratings and Operating Conditions
Maximum Ratings and Operating Conditions
Caution: Stressing the device beyond the absolute maximum ratings may cause perma-
nent damage to the device. These are stress ratings only and operation of the device be-
yond any specification or condition in the operating sections of this datasheet is not
recommended. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
Table 9: Absolute Maximum Ratings
Symbol
TSTG
Parameter
Storage temperature
Min
–65
Max
150
Units Notes
°C
TLEAD
VIO
Lead temperature during soldering
Input and output voltage (with respect to ground)
Supply voltage
–
See note
VCC + 0.6
4.0
°C
V
1
2
–0.6
–0.6
–2000
VCC
V
VESD
Electrostatic discharge voltage (Human Body mod-
el)
2000
V
3
1. The TLEAD signal is compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb as-
sembly), the Micron RoHS compliant 7191395 specification, and the European directive
on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.
Notes:
2. The minimum voltage may reach the value of –2V for no more than 20ns during transi-
tions; the maximum may reach the value of VCC +2V for no more than 20ns during tran-
sitions.
3. The VESD signal: JEDEC Std JESD22-A114A (C1 = 100pF, R1 = 1500Ω, R2 = 500Ω).
Table 10: Operating Conditions
Symbol
Parameter
Min
Max
Unit
Notes
VCC
Supply voltage
2.3
3.6
V
on
page
TA
Ambient operating temperature (grade 6)
Ambient operating temperature (grade 3)
–40
–40
85
°C
°C
125
Table 11: Data Retention and Endurance
Symbol
Condition
Min
100,000
100,000
20
Max
Unit
Program/Erase Grade 6
–
–
–
Cycles per sector
Cycles
Grade 3
Data Retention at 55°C
Years
PDF: 09005aef8456656e
m25p20.pdf - Rev. A 2/13 EN
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