1 Mbit / 2 Mbit / 4 Mbit (x8) Multi-Purpose Flash
SST39LF010 / SST39LF020 / SST39LF040
SST39VF010 / SST39VF020 / SST39VF040
Data Sheet
The SST39LF010, SST39LF020, SST39LF040 and SST39VF010, SST39VF020,
SST39VF040 are 128K x8, 256K x8 and 5124K x8 CMOS Multi-Purpose Flash
(MPF) manufactured with SST’s proprietary, high performance CMOS SuperFlash
technology. The split-gate cell design and thick-oxide tunneling injector attain bet-
ter reliability and manufacturability compared with alternate approaches. The
SST39LF010/020/040 devices write (Program or Erase) with a 3.0-3.6V power
supply. The SST39VF010/020/040 devices write with a 2.7-3.6V power supply.
The devices conform to JEDEC standard pinouts for x8 memories.
Features
• Organized as 128K x8 / 256K x8 / 512K x8
• Single Voltage Read and Write Operations
– 3.0-3.6V for SST39LF010/020/040
– 2.7-3.6V for SST39VF010/020/040
• Fast Erase and Byte-Program:
– Sector-Erase Time: 18 ms (typical)
– Chip-Erase Time: 70 ms (typical)
– Byte-Program Time: 14 µs (typical)
– Chip Rewrite Time:
• Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
2 seconds (typical) for SST39LF/VF010
4 seconds (typical) for SST39LF/VF020
8 seconds (typical) for SST39LF/VF040
• Automatic Write Timing
– Internal V
PP
Generation
• Low Power Consumption
(typical values at 14 MHz)
– Active Current: 5 mA (typical)
– Standby Current: 1 µA (typical)
• End-of-Write Detection
– Toggle Bit
– Data# Polling
• Sector-Erase Capability
– Uniform 4 KByte sectors
• CMOS I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pinouts and command sets
• Fast Read Access Time:
– 55 ns for SST39LF010/020/040
– 70 ns for SST39VF010/020/040
• Latched Address and Data
• Packages Available
– 32-lead PLCC
– 32-lead TSOP (8mm x 14mm)
• All devices are RoHS compliant
©2012 Silicon Storage Technology, Inc.
www.microchip.com
DS25023B
06/13
MICROCHIP [ MICROCHIP TECHNOLOGY ]
