PIC18CXX2
Package Type: 44-Lead Plastic Thin Quad Flatpack (PT)
10x10x1 mm Body, 1.0/0.1 mm Lead Form
E1
E
# leads = n1
p
D
D1
2
1
B
n
X x 45°
L
α
A
R2
c
φ
R1
A1
β
A2
L1
Units
Dimension Limits
Pitch
INCHES
NOM
0.031
44
MILLIMETERS*
MIN
MAX
MIN
NOM
0.80
MAX
p
n
n1
A
A1
A2
R1
R2
L
Number of Pins
Pins along Width
Overall Pack. Height
Shoulder Height
Standoff
Shoulder Radius
Gull Wing Radius
Foot Length
44
11
11
0.039
0.015
0.002
0.003
0.003
0.005
0
0.043
0.025
0.004
0.003
0.006
0.010
3.5
0.047
1.00
1.10
0.64
0.10
0.08
0.14
0.25
3.5
1.20
0.035
0.006
0.010
0.008
0.015
7
0.38
0.05
0.08
0.08
0.13
0
0.89
0.15
0.25
0.20
0.38
7
Foot Angle
φ
Radius Centerline
Lead Thickness
Lower Lead Width
Outside Tip Length
Outside Tip Width
Molded Pack. Length
Molded Pack. Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
*
L1
c
B
0.003
0.004
0.012
0.463
0.463
0.390
0.390
0.025
5
0.008
0.006
0.015
0.472
0.472
0.394
0.394
0.035
10
0.013
0.008
0.018
0.482
0.482
0.398
0.398
0.045
15
0.08
0.09
0.30
11.75
11.75
9.90
9.90
0.64
5
0.20
0.15
0.38
12.00
12.00
10.00
10.00
0.89
10
0.33
0.20
0.45
12.25
12.25
10.10
10.10
1.14
15
†
D1
E1
‡
D
E
‡
X
α
β
5
12
15
5
12
15
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
JEDEC equivalent: MS-026 ACB
7/99 Microchip Technology Inc.
Preliminary
DS39026B-page 281
MICROCHIP [ MICROCHIP ]
