PIC18CXX2
Package Type: 28-Lead Ceramic Dual In-line with Window (JW) – 600 mil
E
W
D
2
n
1
E1
eB
A
A1
L
R
c
B1
A2
p
B
Units
INCHES*
NOM
0.600
28
MILLIMETERS
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
MIN
MAX
MIN
NOM
15.24
MAX
n
p
B
B1
R
c
A
A1
A2
L
D
E
E1
eB
W
28
2.54
0.47
1.46
0.13
0.25
4.70
3.24
0.89
3.49
37.08
13.21
14.73
16.76
7.11
0.098
0.100
0.019
0.058
0.005
0.010
0.185
0.128
0.035
0.138
1.460
0.520
0.580
0.660
0.280
0.102
2.49
0.41
1.27
0.00
0.20
4.32
2.78
0.38
3.18
36.32
13.06
14.22
15.49
6.86
2.59
0.53
1.65
0.25
0.30
5.08
3.70
1.40
3.81
37.85
13.36
15.24
18.03
7.37
0.016
0.050
0.000
0.008
0.170
0.110
0.015
0.125
1.430
0.514
0.560
0.610
0.270
0.021
0.065
0.010
0.012
0.200
0.146
0.055
0.150
1.490
0.526
0.600
0.710
0.290
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
Package Width
Radius to Radius Width
Overall Row Spacing
Window Diameter
* Controlling Parameter.
JEDEC equivalent:
MO-103 AB
7/99 Microchip Technology Inc.
Preliminary
DS39026B-page 277
MICROCHIP [ MICROCHIP ]
