PIC18CXX2
Package Type: 40-Lead Ceramic Dual In-line with Window (JW) – 600 mil
E
W
D
2
n
1
A1
L
E1
A
R
c
eB
B1
A2
p
B
Units
INCHES*
NOM
0.600
40
MILLIMETERS
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
MIN
MAX
MIN
NOM
15.24
40
MAX
n
p
B
B1
R
c
A
A1
A2
L
D
E
E1
eB
W
0.098
0.100
0.020
0.053
0.005
0.011
0.205
0.135
0.035
0.140
2.050
0.520
0.580
0.660
0.350
0.102
2.49
0.41
2.54
0.50
2.59
0.58
1.40
0.25
0.36
5.59
3.89
1.40
3.68
52.32
13.36
15.24
18.03
9.14
0.016
0.050
0.000
0.008
0.190
0.117
0.015
0.135
2.040
0.514
0.560
0.610
0.340
0.023
0.055
0.010
0.014
0.220
0.153
0.055
0.145
2.060
0.526
0.600
0.710
0.360
1.27
0.00
1.33
0.13
0.20
0.28
4.83
5.21
2.97
3.43
0.38
0.89
3.43
3.56
51.82
13.06
14.22
15.49
8.64
52.07
13.21
14.73
16.76
8.89
Package Width
Radius to Radius Width
Overall Row Spacing
Window Diameter
*
Controlling Parameter.
JEDEC equivalent:
MO-103 AC
DS39026B-page 280
Preliminary
7/99 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
