PIC17C75X
22.4
Package Marking Information
68-Lead CERQUAD Windowed
Example
MMMMMMMMMMMMMMMMM
AABBCDE
PIC17C756-04/CL
9750CAE
64-Lead TQFP
Example
MMMMMMMMMM
MMMMMMM
PIC17C752
-08I/PT
AABBCDE
9717CAE
68-Lead PLCC
Example
MMMMMMMMMM
MMMMMMM
PIC17C756
-08/L
AABBCDE
9748CAE
64-Lead SDIP (Shrink DIP)
Example
MMMMMMMMMMMMMMMMM
AABBCDE
PIC17C752-04I/SP
9736CAE
Legend:
MM...M
XX...X
AA
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
BB
C
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
S = Tempe, Arizona, U.S.A.
D
1
E
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
Note:
*
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
DS30264A-page 264
1997 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
