MCP6H91/2/4
TEMPERATURE SPECIFICATIONS
Electrical Characteristics:
Unless otherwise indicated, V
DD
= +3.5V to +12V and V
SS
= GND.
Parameters
Temperature Ranges
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 8L-2x3 TDFN
Thermal Resistance, 8L-SOIC
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
JA
JA
JA
JA
—
—
—
—
52.5
149.5
95.3
100
—
—
—
—
°C/W
°C/W
°C/W
°C/W
T
A
T
A
-40
-65
—
—
+125
+150
°C
°C
Sym.
Min.
Typ.
Max.
Units
Conditions
Note 1:
The internal junction temperature (T
J
) must not exceed the absolute maximum specification of +150°C.
1.2
Test Circuits
C
F
6.8 pF
R
G
100 k
V
P
V
IN+
MCP6H9X
V
IN–
V
M
R
G
100 k
R
F
100 k
C
F
6.8 pF
V
OUT
R
L
10 k
C
L
60 pF
C
B1
100 nF
R
F
100 k
V
DD
C
B2
1 µF
V
DD
/2
The circuit used for most DC and AC tests is shown in
This circuit can independently set V
CM
and
V
OUT
(refer to
Note that V
CM
is not the
circuit’s Common mode voltage ((V
P
+ V
M
)/2), and that
V
OST
includes V
OS
plus the effects (on the input offset
error, V
OST
) of temperature, CMRR, PSRR and A
OL
.
EQUATION 1-1:
G
DM
=
R
F
R
G
V
CM
=
V
P
+ V
DD
2
2
V
OUT
=
V
DD
2
+
V
P
–
V
M
+ V
OST
1 + G
DM
Where:
G
DM
= Differential Mode Gain
V
CM
= Op Amp’s Common Mode
Input Voltage
V
OST
= Op Amp’s Total Input Offset
Voltage
(V/V)
(V)
(mV)
V
OST
=
V
IN–
–
V
IN+
V
L
FIGURE 1-1:
AC and DC Test Circuit for
Most Specifications.
2012 Microchip Technology Inc.
DS25138B-page 5
MICROCHIP [ MICROCHIP TECHNOLOGY ]
